Electronics

XERION-AG LINE

Xerion-Ag is the silver plating family designed for high volumes, capable of ensuring high performance and reproducibility in terms of stability and the quality of a bright, mirror-white color, meeting the demands of highly technological and regulated markets.
The deposit is characterized by high ductility even at thick layers and excellent throwing power.

Process management is very simple:
— Optimal results can be achieved across a wide current density range
— Only minimal analytical controls are required

Any excess brightener does not compromise bath stability. With the addition of a specific additive, the hardness of the deposit can be further increased to exceed 200 HV, making this system ideal, for example, for the production of cutlery (see “Additional Information” section).

XERION-AU LINE

Pure Gold
Gold plating process with an extremely pure, bright, and ductile gold deposit featuring a fine and compact crystalline grain, suitable for reel-to-reel, rack, or barrel applications. Thanks to the wide range of possible operating conditions, Xerion-Au can be used in rotary barrel, vibrobot, rack, or high-speed machinery, where very high current densities are applied.
Xerion-Au solutions offer high chemical stability, ease of use, and good resistance to metal contamination.

Cobalt Alloy
Bright yellow deposit, low porosity, and high purity.
Stable process with high efficiency and speed at high current densities; minimal deposit overload at low current density.

Nickel Alloy
Selective, high-speed, mirror-bright deposits.
Uniform and consistent deposits over a wide current density range.
Suitable for reel-to-reel, rack, and barrel applications.

Gold Strike
Slightly acidic gold strike developed to improve the adhesion of subsequent electroplated layers.

XERION-PD LINE

Pure Palladium
Bright and ductile deposit for reel-to-reel, rack, or barrel applications.

Palladium Alloy
Available in “HS” (High Speed) and “LS” (Low Speed) versions, with low-consumption options.
Bright and ductile deposits, offering excellent contact stability and wear resistance.

XERION-RU LINE

Acid-based plating process with pure ruthenium that deposits a highly abrasion- and corrosion-resistant layer with a titanium-gray color.
Its formulation ensures low internal stress, allowing the achievement of high thicknesses (> 1 micron) with good efficiency.

Xerion-Ru can be used for both decorative and technical applications in the electronics and optics sectors.
The deposit is durable and can reach a maximum thickness of 2.0 microns. Since ruthenium has lower efficiency compared to other precious metals, the electrolyte requires a higher metal concentration and longer current-on immersion times in order to guarantee a certain deposit thickness.

XERION-PT LINE

Plating process characterized by acidic or alkaline electrolytic solutions capable of providing bright, hard, and highly pure deposits. Xerion-Pt is suitable both for industrial and decorative applications, as well as in cases where the exceptional chemical and physical properties of platinum are required.

XERION-CU LINE

Xerion-Cu is a copper plating process that offers different types of deposits:

Bright, Matte
High-speed plating for medium-high current densities, available in sulfuric acid- or MSA-based solutions.

Strike
Cyanide-based copper strike.

XERION-TIN LINE

Nickel-Phosphorus Alloy
Nickel-phosphorus deposit (3–12% by weight of P) based on sulfamate for improved corrosion resistance and non-magnetic properties. High-speed plating and a wide operating window allow precise control of the alloy composition.

Pure Semi-bright Matte Nickel
Deposits a semi-bright layer with slight stress and good ductility. Ideal as a base layer for both precious and non-precious metal deposits.